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QCS603

SUMMARY

10nm SoC purpose-built to deliver high-performing, power-efficient edge computing for next-generation smart cameras and smart home applications with a quad-core CPU and 4K video capture.

The Qualcomm® QCS603 SoC is a high performance IoT System-on-Chip (SoCs) that incorporates key features for building advanced use cases encompassing machine learning, edge computing, sensor processing, voice UI enablement and integrated wireless connectivity.

The 10nm QCS603 SoC is engineered to deliver powerful computing for on-device camera processing and machine learning, with exceptional power and thermal efficiency, across a wide range of IoT applications. It integrates a powerful image signal processor (ISP) and the Qualcomm® Artificial Intelligence (AI) Engine, along with a heterogeneous compute architecture including a low-power, highly-optimized custom CPU, GPU and DSP.

The QCS603 SoC also features Qualcomm® Noise and Echo Cancellation, as well as advanced on-device audio analytics and processing features to support natural language processing, audio speech recognition, and “barge-in” capability for a reliable voice interface even in loud or noisy environments or when users are far from the device.

SPECIFICATION

CPU Customized, 64-bit ARM v-8 compliant applications processor,
Qualcomm® Kryo™ 300 CPU, consisting of
Kryo Gold: Two high-performance cores up to 1.6 GHz – Gold cluster with 256 KB L2 cache per core
Kryo Silver: Two low-power cores up to 1.7 GHz – Silver cluster with 128 KB L2 cache per core
GPU Adreno 615, 3D graphics accelerator with 64-bit addressing, 780 MHz (maximum frequency)
OpenGL ES 3.2, Vulkan, DX 12.x, OpenCL 2.x, Microsoft DirectCompute, RenderScript
DSP Hexagon DSP with Hexagon Vector eXtensions (dual-HVX512)
1.2 GHz for machine learning, integrated DNN for advanced VA, and
Snapdragon neural processing engine framework
Memory Dual-channel non-PoP high-speed memory – LPDDR4X SDRAM designed for a 1866 MHz clock (2 × 16-bit)
Support for UFS 2.1 gear 3 (one lane), eMMC 5.1, and SD 3.0
Camera 16 + 16 IFEs, 24 MP, SHDR, MCTF, fisheye dewarp, EIS,
MIPI CSI 3 × 4 lanes, C-PHY, D-PHY
MIPI combination D-PHY 1.2/C-PHY 1.0 configurable in either 4/4/4 or 4/4/2/1
 D-PHY: 2.5 Gbps/lane
 C-PHY: ~17 Gbps (2.5 G symbols per trio per second)
Display Display support: 1080p at 30 fps (embedded) + 4K (external) up to 10 hardware layers,
Qualcomm® EcoPix™ display feature, and
Qualcomm® TruPalette™ display feature, VESA DSC 1.1
Audio Option 1: QCS603 (through SoundWire) + WSA8810/WSA8815 speaker amplifier
Option 2: WCD9326/WCD9335 codec + WSA8810/WSA8815 speaker amplifier
Option 3: WCD9340 codec + WSA8810/WSA8815 speaker amplifier
Option 4: WCD9341 codec + WSA8810/WSA8815 speaker amplifier
Wireless Connectivity WCN3980: WLAN 1 × 1 802.11a/b/g/n/ac and Bluetooth 5.0
Wired Connectivity Qualcomm universal peripheral(QUP) ports 13, 4 bits each; multiplexed serial interface functions

DELIVER LIST

Hardware kit
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